Quality Control in Reducing Waste Defects in the Production Process Using the VSM Method in Electronics Component Manufacturing Company

Abstract

If a company experiences a surge in the number of defects on the Frame Main Raph 322 production line, this is a serious problem that needs to be addressed immediately. The purpose of this study is to ensure the achievement of QTPP (Quality Target Product Profile), namely by knowing the high rate of defects, namely the average for 1 year is 2.5%, namely as many as 725 pcs/year, the largest defect is found, namely in the type of defect Unpos board assy of 39 %. In repairing and improving the production line, it is necessary to identify the causes of waste. Lean Six Sigma integration using the DMAIC, VSM and VALSAT methods is an effective way to determine waste and causes of waste. The analysis phase is carried out by knowing the VA and NVA values and implementing improvements based on FMEA.