Quality Control in Reducing Waste Defects in the Production Process Using the VSM Method in Electronics Component Manufacturing Company

Authors

  • Alfa Firdaus Faculty of Engineering, Mercu Buana University, Indonesia
  • Indra Almahdy Faculty of Engineering, Mercu Buana University, Indonesia
  • Atep Alfia Hidayat Faculty of Engineering, Mercu Buana University, Indonesia
  • Selamet Riadi Faculty of Engineering, Mercu Buana University, Indonesia
  • Dede Rukmayadi Faculty of Engineering, Universitas Bhayangkara Jakarta Raya, Indonesia
  • Jakfat Haekal Faculty of Engineering, Universitas Bhayangkara Jakarta Raya, Indonesia
  • Tri widodo Faculty of Engineering, universitas muhammadiyah tangerang, Indonesia

DOI:

https://doi.org/10.54756/IJSAR.2024.14

Keywords:

DMAIC, FMEA, Lean Six Sigma, VSM, VALSAT

Abstract

If a company experiences a surge in the number of defects on the Frame Main Raph 322 production line, this is a serious problem that needs to be addressed immediately. The purpose of this study is to ensure the achievement of QTPP (Quality Target Product Profile), namely by knowing the high rate of defects, namely the average for 1 year is 2.5%, namely as many as 725 pcs/year, the largest defect is found, namely in the type of defect Unpos board assy of 39 %. In repairing and improving the production line, it is necessary to identify the causes of waste. Lean Six Sigma integration using the DMAIC, VSM and VALSAT methods is an effective way to determine waste and causes of waste. The analysis phase is carried out by knowing the VA and NVA values and implementing improvements based on FMEA.

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How to Cite

Alfa Firdaus, Indra Almahdy, Atep Alfia Hidayat, Selamet Riadi, Dede Rukmayadi, Jakfat Haekal, & Tri widodo. (2024). Quality Control in Reducing Waste Defects in the Production Process Using the VSM Method in Electronics Component Manufacturing Company. International Journal of Scientific and Applied Research (IJSAR), EISSN: 2583-0279, 4(7), 13–21. https://doi.org/10.54756/IJSAR.2024.14

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